Layered Capability Architecture
Capture Layer
Microphone arrays and hi-fi pickup keep the source signal pure
AI Processing Layer
A self-developed DSP matrix enhances and cleans speech in real time
IoT Connectivity Layer
Device onboarding, status reporting and remote coordination
Output Layer
Playback and reinforcement designed for spatial aesthetics
Management & Platform Layer
Longoo Pro hosts algorithms, firmware and licensing in one platform
Audio Capture
From transducer selection to array layout, every frame stays pure from the source.
Audio Processing
A self-developed DSP matrix handles echo cancellation, noise reduction, beamforming and auto-mixing in real time.
Audio Playback
Playback tuned for the voice band, balancing fidelity with spatial aesthetics.
IoT Connectivity & Device Management
Unified onboarding, status reporting, remote configuration and firmware updates.
Algorithm Modularization & Porting
Longoo Pro packages algorithms as modular SDKs for rapid multi-chip porting.
Technical Specs & Chip Adaptation
- ARM
- x86
- ADI
- TI
- DSP
- AEC
- BF
- AGC
- ANC
- AMM
- SDK/API
- OTA
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